New Silicon Realization convergence approach embodies EDA360 vision

CAD Design Software releases solutions for lead frame package design

June 02, 2011 | By Newsdesk

Decrease Increase

CAD Design Software, a leader in integrating mechanical and electrical design tools, recently announced the release of their solution for Lead Frame package design utilizing unique technology convergence between CAD Design’s Electronics Packaging Designer (EPD) and the Cadence Design Systems Allegro IC Package design and analysis environment. The collaborative solution enables a Silicon Realization flow for ICs that reside in Lead Frame packages. ...cont´d

Want to Read More? Try a Premium Membership. Please Login

Decrease Increase

Post Comment >>

Ads by Google

RELATED LINKS

Packaging South Asia Magazine

Issue : Volume 6, Issue 4 PackagingSouthAsia.com is the online version of Packaging South Asia, in print as a monthly trade magazine since the beginning of 2007. What's in this issue?
Back issue?

Ads by Google

e-NEWSLETTER

Would you like to get industry news delivered to your inbox? Sign up for our weekly newsletter.

Email :

EVENT CALENDAR

All text, content and images on this site are the intellectual property of Packaging South Asia, N10, Sector XI, Noida, 201301, Uttar Pradesh, India. All permissions for fair use may be sought in writing from the above address. For further information or clarification contact editor@ippgroup.in . The publishers reserve the right to deny permission or to make appropriate conditions and take steps of abundant caution.

The Magagine for Modern Packaging