Seminar organized by Bobst India

Flexible packaging in the South Asian context

Bobst India organised and hosted flexible packaging seminars in Hyderabad and Delhi. In Delhi on 13 April 2010 there were approximately 65 participants, and in Hyderabad on 14 April, approximately 85. The seminars were attended by discussants from several flexible packaging converting companies across India and Sri Lanka, as well as several international delegates from Europe.

May 28, 2010

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The focus of the presentations and discussion was on the latest technological developments in gravure, flexography, lamination and slitting rewinding for flexible packaging printingand converting. These were presented by Bobst Group companies Fischer & Krecke, Rotomec and Titan. Specialists of Bobst India’s partner suppliers complemented the technical review of state-of-the-artindustry developments.

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