April 13, 2017

Bosch at interpack 2017 – Hall 6 Stand A31

New gentle and scalable cookie and cracker packaging systems

At interpack 2017, Bosch Packaging Technology will debut scalable packaging systems for sweet and savoury biscuits for slug and pile packs. These are easily adapted to changing market needs, allowing trade show visitors to learn which solution is best suited to satisfy their requirements on-site.


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