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January 09, 2009
Uflex, India’s leading and only fully integrated flexible packaging group, have decided to instal a wide width flexo CI press with Electron Beam (EB) curing at their Noida plant to cater to special requirements, primarily for export markets. The press is a 1500 mm. wide 10-colour Miraflex from Windmoller & Holscher that can run at 500 meters/minute and the EB curing station is being supplied by ESI. According to Uflex, this is the first CI press + EB curing installation in the world for hard core film-based flexible packaging. There are three web flexo + EB curing presses already in operation but they are only doing paper and board laminates. Therefore, this is probably the first really hi-tech flexible packaging project that is being pioneered by an Indian company.
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Issue : Volume 6, Issue 4
PackagingSouthAsia.com is the online version of Packaging South Asia, in print as a monthly trade magazine since the beginning of 2007.
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